In late 2025, at a flagship global semiconductor industry exhibition, a novel low-GWP (Global Warming Potential) etching gas—designed to replace the traditional high-GWP trifluoromethane (CHF₃, or HFC-23)—made its public debut, instantly triggering a chain reaction across the entire industry value chain. This achievement represents not only a pivotal breakthrough in green manufacturing for critical semiconductor consumables but also signals a fundamental restructuring of industry standards centered on low-GWP etching gases—a shift rapidly taking hold within global wafer procurement systems.